Mems Packaging by Tai-Ran Hsu 0000-00-00 00:00:00

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by Tai-Ran Hsu
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Mems Packaging by Tai-Ran Hsu
Author
Tai-Ran Hsu
Publisher
Institution of Engineering & Technology
Date of release
Pages
305
ISBN
9780863413353
Binding
Hardcover
Illustrations
Format
PDF, EPUB, MOBI, TXT, DOC
Rating
5
48
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Book review

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and mircrosystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.

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